Shenzhen kiʻekiʻe alumini PCB MCPCB me Taiyo PSR-4000 series maʻemaʻe keʻokeʻo solder mask
Hana Hana:
mea | Hana Hana |
Mea waiwai | FR4, CEM-1, Aluminum, Poly amide |
Layer No. | 1-12 |
Ka mānoanoa o ka papa | 0.1 mm-4.0mm |
Hoʻomanawanui Mānoanoa Papa | ±10% |
Mānoanoa Cooper | 0.5 OZ-3OZ (18 um-385 um) |
Puka Pa'i keleawe | 18-40 um |
Ka hoʻomalu impedance | ±10% |
Warp&Twist | 0.70% |
Hiki i ka Peel | 0.012"(0.3mm)-0.02'(0.5mm) |
Nā kiʻi
Min Laulā Meheu (a) | 0.075mm (3mil) |
Min Laulā ʻĀpana (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm (8 mil) |
Kūlana BGA (b) | 0.2 mm (8 mil) |
Palekana Solder
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Hoʻomaʻemaʻe i ka pale huna (b) | 0.1mm (4 mil) |
Māwae SMT Pad min (c) | 0.1mm (4 mil) |
Mānoanoa Solder Mask | 0.0007" (0.018mm) |
Puka
Ka nui o ka lua min (CNC) | 0.2 mm (8 mil) |
Min Punch Hole Nui | 0.9 mm (35 mil) |
Ka nui o ka puka TOL (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Kūlana Hole TOL | ±0.075mm |
Pāpalapala
HASL | 2.5um |
HASL noa ke alakai | 2.5um |
Gula Kaiapuni | Nikela 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Hōʻike
Papa Hoʻolaha TOL (+/-) | CNC: ±0.125mm, Puni: ±0.15mm |
ʻO ka beveling | 30°45° |
Koki manamana lima gula | 15° 30° 45° 60° |
Palapala | ROHS, ISO9001: 2008, SGS, palapala UL |
Hiki iā mākou ke hana iā ʻoe:
1-12 papa FR4 PCB.
1-2 ʻāpana alumini PCB.
1-4layer maʻalahi PCB.
CEM-1 PCB
94VO PCB
SMT a me DIP lawelawe hui.


E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou