ʻO Shenzhen PCB MCPCB alumini kiʻekiʻe kiʻekiʻe me Taiyo PSR-4000 series mask keʻokeʻo solder keʻokeʻo

kū i ka ipad hoʻoneʻe, nā mea paʻa papa paʻa


ʻIke kikoʻī

Ka hana hana: 

'ikamu Hiki i ka hana
Mea Pono FR4, CEM-1, Aluminium, Poly amide
Layer No. 1-12
Pau ka mānoanoa o ka papa 0.1 mm-4.0mm
ʻO ke ahonui o ka papa mānoanoa ± 10%
Mānoanoa ʻo Cooper 0.5 OZ-3OZ (18 um-385 um)
Hole keleawe keleawe 18-40 um
Ka mālama Impedance ± 10%
ʻO Warp & Twist 0.70%
Hiki peel 0.012 "(0.3mm) -0.02 '(0.5mm)

Nā Kiʻi

ʻO Min Widace Width (a) 0.075mm (3mil)
ʻO Min Width Width (b) 0.1mm (4 mil)
Min Annular Kālā 0.1mm (4 mil)
ʻO SMD Pitch (a) 0.2 mm (8 mil)
ʻO BGA Pitch (b) 0.2 mm (8 mil)

Makakiʻi paukū

ʻO Min Solder Mask Dam (a) 0.0635 mm (2.5mil)
Hoʻomaʻamaʻa pale maka maka (b) 0.1mm (4 mil)
ʻO Min SMT pale spacing (c) 0.1mm (4 mil)
Mānoanoa mask mask 0.0007 "(0.018mm)

Nā Lā

Ka nui o Min Hole (CNC) 0.2 mm (8 mil)
Ka Hole Min Punch 0.9 mm (35 mil)
Ka Hole Nui TOL (+/-) PTH: ± 0.075mm; NPTH: ± 0.05mm
Kūlana Hole TOL ± 0.075mm

Pākuʻi

HASL 2.5um
Alakaʻi noa HASL 2.5um
Gula Kaiapuni Nickel 3-7um Au: 1-5u ''
OSP 0.2-0.5um

Outline

Papa Kuhikuhi TOL (+/-) ʻO CNC: ± 0.125mm, Pākuʻi ʻana: ± 0.15mm
Beveling 30 ° 45 °
Kihi manamana gula 15 ° 30 ° 45 ° 60 °
Palapala  ROHS, ISO9001: 2008, SGS, palapala hōʻike UL

Hiki iā mākou ke hana iā ʻoe:

1-12 papa FR4 PCB.

1-2layer alumini PCB.

1-4layer PCB loli.

CEM-1 PCB

94VO PCB

SMT a me ka hui ʻana ʻo DIP.

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