Maikaʻi Metal Core PCB no nā noi he nui
Papahana | 1 papa a me 2 papa |
Ka mānoanoa o ka papa | 0.3-5mm |
Min.laula laina/space | 4mil/4mil (0.1mm/0.1mm) |
Min.Ka nui o ka puka | 12mil (0.3mm) |
Max.Nui papa | 1500mm*8560mm (59in*22in) |
Hole kūlana hoʻomanawanui | +/-0.076mm |
Ka mānoanoa o ke keleawe | 35um~240um (1OZ~7OZ) |
Noho ka mānoanoa ma hope o V-CUT | +/-0.1mm |
Ua Pau ka Ili | Ke alakaʻi manuahi HASL, ke gula immersion (ENIG), ke kala immersion, OSP, etc. |
Mea Kumu | Koko Aluminum, Koko keleawe, Koko Hao, *SinkPAD Tech |
Hiki ke hana | 30,000 sqm / mahina |
ʻO ka ʻae ʻana i ka moʻolelo: ka hoʻokuʻu ʻana i ka outline tolerance | +/-0.13mm;ke kuʻi ʻana i ka outline tolerance: +/- 0.1mm |
Noi oMCPCB | |
Nā kukui LED | ʻO LED kiʻekiʻe, Spotlight, PCB kiʻekiʻe |
ʻOihana mana hana | Transistors mana kiʻekiʻe, transistor arrays, push-pull a i ʻole totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-change device (Inverter). ) |
Nā kaʻa | mea puhi, mea hooponopono mana, mea hoololi, mea hooponopono mana, nenoaiu optical variable |
Ka mana | moʻo hoʻoponopono uila, hoʻololi hoʻololi, nā mea hoʻololi DC-DC |
Leo | hoʻokomo - hoʻonui puka, hoʻonui kaulike, hoʻonui pale mua, hoʻonui leo, hoʻonui mana. |
OA | Keaukaha mīkini paʻi, pani hōʻike uila nui, poʻo paʻi wela |
Leo | hoʻokomo - hoʻonui puka, hoʻonui kaulike, hoʻonui pale mua, hoʻonui leo, hoʻonui mana. |
ʻO nā mea ʻē aʻe | ʻO ka papa hoʻoheheʻe wela semiconductor, nā pūʻulu IC, nā mea pale pale, nā puʻupuʻu lawe Ics, ka wela wela, nā mea hoʻoheheʻe solar, ka mea hoʻoheheʻe semiconductor. |
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou