Ka hiki

Nā mana FR4:

'ikamu ʻIkepili ʻenehana
ʻAno Mea FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA
Mānoanoa Mea 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005"
Helu papa 1 a 20 papa
Max.Nui o ka Papa 22.00” x 28.00”
Papa IPC Papa II, Papa III
apo Annular 5 mil/ʻaoʻao a ʻoi aku paha (Min. Design)
Hoʻopau Paʻa Solder(HASL), Lead Free Solder(L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, etc.
Kaumaha keleawe Ma waho: A hiki i 7oz, Iloko: a hiki i 4 oz.
Laulā/Luna 3/3 mil
ʻO ka nui o ka pā liʻiliʻi 12 mil
Nā Kau Paʻa 0.016"
Puka liʻiliʻi loa 8mil;4 mil
Manalima Gula 1 a 4 ʻEke (30 a 50 Micron Gula)
SMD Pitch 0.080” - 0.020” - 0.010”
ʻAno Soldermask LPI ʻōlinolino, LPI-Matte
Kalai Soldermask ʻOmaomao, ʻulaʻula, ʻulaʻula, ʻeleʻele, keʻokeʻo, melemele, akaka
Kala Kaao Keʻokeʻo, Melemele, ʻEleʻele, ʻulaʻula, ʻulaʻula.
Laulā alanui liʻiliʻi 0.031”
Ka helu ʻana (v-cut) Nā Laina Pololei, Lele Makai, CNC V-CUT.
gula PAʻakikī, ʻoluʻolu, IMMERSION (a hiki i 50 MICRON GOLD)
Hōʻike waihona ʻikepili Gerber RS-274x me ka puka embedder.
ʻO Fab.Hōʻano kiʻi Nā Kōnae Gerber, DXF, DWG, PDF
ʻAspect Ratio 10:01
Pahu Pahu / Puka Counter ʻAe
Manaʻo Paʻa ʻAe
Vias makapō / Vias kanu ʻia ʻAe
Maka Peelable ʻAe
Kalapona ʻAe

MC PCB hiki:

'ikamu ʻIkepili ʻenehana
Ka helu o nā papa ʻaoʻao hoʻokahi, ʻaoʻao ʻelua, ʻehā ʻaoʻao MCPCB
ʻAno huahana Aluminum, keleawe, hao kumu MCPCB
Mea hoʻolako i ka laminate Berquist, Ventec, Polytronics, Boyu, Wazam etc.
Hoʻopau i ka mānoanoa o ka papa 0.2-5.0mm
Ka mānoanoa keleawe Hoz—3oz
Mea kūʻai aku i ka mask solder Taiyo, Fotochem etc.
Ke kala o ka huna huna Keʻokeʻo, ʻeleʻele, ʻulaʻula, uliuli, melemele etc.
Hoʻopau ʻili L/F HASL, OSP, ENIG, Kālā Electrolytic, Tin Immersion, Kālā Immersion etc.
Ke ʻano o ka outline i hoʻopau ʻia Alanui, Kuʻi, ʻoki V
Kūlou a wili ≤0.75%
Ka nui o ka lua min 1.0mm
Max.nui o ka papa 1500mmX610mm
Min.nui o ka papa 10mmX10mm