PAD poho

  • Thermal management Printed Circuit Board (PCB)-SinkPAD TM

    Hooponopono wela ka Papa Kaapuni Pai (PCB)-SinkPAD TM

    ʻO SinkPADhe ʻenehana no ka hoʻokele wela i ka Papa Kaapuni Pai (PCB).ʻo ia ka mea e hiki ai ke hoʻokuʻu i ka wela mai kahi LED a i ka lewa me ka wikiwiki a ʻoi aku ka maikaʻi ma mua o kahi MCPCB maʻamau.Hāʻawi ʻo SinkPAD i ka hana wela maikaʻi loa no nā LED mana kiʻekiʻe.

  • Low-cost Aluminum core laminated copper foil SinkPAD PCB

    ʻO ke kumu kūʻai ʻo Aluminum core laminated copper foil SinkPAD PCB

    He aha ka Thermoelectric Separation Substrate?
    Hoʻokaʻawale ʻia nā papa kaapuni a me ka pā wela ma luna o ka substrate, a ʻo ke kumu wela o nā mea wela e hoʻopili pololei i ka mea hoʻokele wela e hoʻokō i ka hopena maikaʻi loa (zero thermal resistance).ʻO ka mea maʻamau o ka substrate he mea metala (Copper) substrate.
  • Direct thermal path MCPCB and Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Ke ala wela pololei MCPCB a me Sink-pad MCPCB, Copper Core PCB, Copper PCB

    Nā kikoʻī Huahana Mea Mānoanoa: Alu/ keleawe keleawe mānoanoa:0.5/1/2/3/4 OZ Mānoanoa Papa:0.6-5mm Min.Ka Anawaena Hole:T/2mm Min.Laina Laulā:0.15mm Min.Laina Spacing: 0.15mm Ili Pau: HASL, Immersion gula, Flash gula, plated silver, OSP Item name:MCPCB LED PCB Papa kaapuni paʻi, Aluminum PCB, keleawe kumu PCB V-cut Angle:30°,45°,60° Shape ka hoʻomanawanui:+/-0.1mm Hole DIA hoʻomanawanui:+/-0.1mm Thermal Conductivity:0.8-3 W/MK E-hōʻike uila: 50-250V Peel-off ikaika:2.2N/mm Warp a wili paha: