Ke hāʻule ka uea keleawe o PCB, e hoʻopaʻapaʻa nā PCB a pau he pilikia laminate a koi i kā lākou mea kanu hana e lawe i nā poho maikaʻi ʻole.Wahi a nā makahiki he nui o ka hoʻopiʻi ʻana o ka mea kūʻai aku, ʻo nā kumu maʻamau no ka hāʻule ʻana o ke keleawe PCB penei:
1,ʻO nā kumu kaʻina hana PCB:
1), Ua hoʻopaʻa ʻia ʻo Copper foil.
ʻO ka pahu keleawe electrolytic i hoʻohana ʻia ma ka mākeke ʻo ia ka galvanized ʻaoʻao hoʻokahi (ʻike mau ʻia ʻo ka foil lehu) a me ka pale keleawe ʻaoʻao hoʻokahi (i ʻike ʻia ʻo ka foil ʻulaʻula).ʻO ka hōʻole keleawe maʻamau ʻo ia ka galvanized copper foil ma luna o 70UM.ʻAʻohe pūʻulu keleawe e hōʻole ʻia no ka pepa ʻulaʻula a me ka pahu lehu ma lalo o 18um.Ke ʻoi aku ka maikaʻi o ka hoʻolālā kaapuni ma mua o ka laina etching, inā hoʻololi ke kikoʻī keleawe keleawe a hoʻololi ʻole ʻia nā ʻāpana etching, lōʻihi loa ka manawa noho o ka pahu keleawe i ka hopena etching.
No ka mea, ʻo ka zinc he metala ikaika, i ka wā i hoʻomoʻi ʻia ai ka uea keleawe ma ka PCB i ka hopena etching no ka manawa lōʻihi, e alakaʻi ia i ka corrosion ʻaoʻao laina nui, e hopena i ka hopena piha o kekahi laina lahilahi e kākoʻo ana i nā papa zinc a kaʻawale mai ka substrate, ʻo ia hoʻi, hāʻule ke kaula keleawe.
ʻO kekahi kūlana ʻaʻohe pilikia me nā ʻāpana etching PCB, akā ʻilihune ka holoi ʻana a me ka hoʻomaloʻo ʻana i ka wai ma hope o ka etching, ʻo ia hoʻi, ua hoʻopuni ʻia ka uea keleawe e ke koena etching solution ma ka ʻaoʻao halepaku PCB.Inā ʻaʻole mālama ʻia no ka manawa lōʻihi, e hana pū ia i ka corrosion ʻaoʻao nui o ka uea keleawe a hoʻolei i ke keleawe.
Hoʻopili pinepine ʻia kēia kūlana ma ke ala laina lahilahi a i ʻole ka wā pulu.E ʻike ʻia nā hemahema like ma ka PCB holoʻokoʻa.E ʻoki i ka uea keleawe e ʻike ai ua loli ke kala o kona ʻili pili me ka papa kumu (ʻo ia ka mea i kapa ʻia ka ʻili coarsened), he ʻokoʻa ia mai ke kala o ke kala keleawe maʻamau.ʻO ka mea āu e ʻike ai, ʻo ia ke kala keleawe maoli o ka papa lalo, a ʻo ka ikaika o ka peel o ke keleawe keleawe ma ka laina mānoanoa he mea maʻamau.
2), Loaʻa ka hoʻokūkū kūloko i ke kaʻina hana PCB, a ua hoʻokaʻawale ʻia ke kaula keleawe mai ka substrate e ka ikaika mechanical waho.
Aia kekahi pilikia me ka hoʻonoho ʻana o kēia hana maikaʻi ʻole, a ʻo ka uea keleawe hāʻule e ʻike ʻia ka distortion, a i ʻole nā ʻōpala a i ʻole nā hōʻailona hopena ma ke ala like.E ʻili i ka uwea keleawe ma ka ʻaoʻao ʻino a nānā i ka ʻili o ka ʻili keleawe.Hiki ke ʻike ʻia he maʻamau ka waihoʻoluʻu o ka ʻili keleawe keleawe, ʻaʻohe ʻaoʻao corrosion, a he mea maʻamau ka ikaika wehe ʻana o ka pahu keleawe.
3), ʻAʻole kūpono ka hoʻolālā kaapuni PCB.
ʻO ka hoʻolālā ʻana i nā laina lahilahi me ka pepa keleawe mānoanoa e hoʻoulu ai i ka hoʻopaʻa ʻana i ka laina a me ka hōʻole keleawe.
2,ʻO ke kumu o ka hana laminate:
Ma lalo o nā kūlana maʻamau, ʻoiai ʻoi aku ka lōʻihi o ka ʻāpana wela wela o ka laminate ma mua o 30 mau minuke, ua hui pū ʻia ka pahu keleawe a me ka pepa semi cured, no laila ʻaʻole e hoʻopilikia ka paʻi ʻana i ka ikaika paʻa ma waena o ka foil keleawe a me ka substrate i loko o ka laminate.Eia nō naʻe, i ke kaʻina hana o ka lamination a me ka hoʻopaʻa ʻana, inā hoʻohaumia ʻia ʻo PP a i ʻole ka pohō o ka ʻili o ke keleawe keleawe, e alakaʻi ia i ka lawa ʻole o ka ikaika hoʻopaʻa ma waena o ke keleawe keleawe a me ka substrate ma hope o ka lamination, e hopena i ka hoʻololi ʻana (no nā papa nui wale nō). a i ʻole ka hāʻule ʻana o ka uea keleawe maʻamau, akā ʻaʻohe mea ʻino i ka ikaika o ka peel o ka pepa keleawe ma kahi kokoke i ka laina waho.
3, Laminate kumu kumu kumu:
1), E like me ka mea i ʻōlelo ʻia ma luna, hoʻohana ʻia ka foil keleawe electrolytic maʻamau a i ʻole nā huahana keleawe o ka hulu hipa.Inā ʻino ka waiwai kiʻekiʻe o ka hulu hipa i ka wā o ka hana ʻana, a ʻilihune paha nā lālā aniani i ka wā galvanizing / copper plating, no laila ʻaʻole lawa ka ikaika o ka peel o ka foil keleawe ponoʻī.Ma hope o ka paʻi ʻia ʻana o ka foil maikaʻi ʻole i ka PCB, e hāʻule ka uea keleawe ma lalo o ka hopena o ka ikaika o waho i ka plug-in o ka hale hana uila.He ʻilihune kēia ʻano kīloi keleawe.Ke wehe ʻia ka uea keleawe, ʻaʻole e ʻike ʻia ka ʻino o ka ʻaoʻao ma ka ʻili o ka ʻili keleawe (ʻo ia hoʻi ka ʻili pili me ka substrate), akā ʻilihune loa ka ikaika o ka peel o ka pahu keleawe holoʻokoʻa.
2), Ka hoʻololi maikaʻi ʻole ma waena o ka foil keleawe a me ka resin: no kekahi mau laminates me nā waiwai kūikawā, e like me ka pepa HTG, ma muli o nā ʻōnaehana resin ʻokoʻa, ʻo ka mea hoʻōla i hoʻohana ʻia ʻo PN resin maʻamau.He mea maʻalahi ke kaulahao molekala o ka resin a he haʻahaʻa ke degere hoʻohui keʻa i ka wā e hoʻōla ai.Pono e hoʻohana i ka foil keleawe me ka piko kūikawā e hoʻohālikelike ai.Ke hoʻohana ʻole ʻia ka pahu keleawe i ka hana ʻana i ka laminate i ka ʻōnaehana resin, ka hopena i ka lawa ʻole o ka ikaika peel o ka pahu metala i uhi ʻia ma ka pā, a hāʻule ka uea keleawe maikaʻi i ka wā e hoʻokomo ai.
Ka manawa hoʻouna: ʻAukake-17-2021