| 'ikamu | Hiki maʻamau | E kaupalena i ka hiki | 'ikamu | Hiki maʻamau | E kaupalena i ka hiki |
| Layer No. | 2-16 | ≤20 | Max.ka mānoanoa keleawe (Papa loko) | 4OZ | 5OZ |
| Mānoanoa papa kumu | 0.075-2.0mm | 0.05-3.0mm | Max.mānoanoa keleawe (Outer layer) | 4OZ | 6OZ |
| min.PTH i ke keleawe | 165.1um | 152.4um | Min.ka hakahaka ma waena o nā pā SMD no ke alahaka S/M | 203.2um | 177.8um |
| ʻO ka mānoanoa o ka papa (ʻaoʻao pālua) | 0.3-3.2mm | 0.3-4mm | laula/kiʻekiʻe kaʻao liʻiliʻi | 127um /762um | 101.6um /609.6um |
| Mānoanoa papa(Papa-nui) | 0.6-3.2mm | 0.6-4mm | ʻO ka hoʻomanawanui ʻana o ke ana outline | ±101.6um | ±76.2um |
| Ka hoʻomanawanui o ka mānoanoa o ka papa (T≤0.8mm) | 0.1mm | 0.075mm | Kakaka & wili （T≤1mm） | ≤0.75% | ≤0.5% |
| Ka hoʻomanawanui o ka mānoanoa o ka papa（T＞0.8mm） | ±10% | ±5% | Kakaka & wili （T≤1mm） | ≤0.5% | ≤0.3% |
| Min.laula laina | 76.2um | 63.5um | Ka pololei o ka lua i ka lua | ±0.05mm | / |
| Lila laina liʻiliʻi | 68.58um | 63.5um | Laulā hoʻomalu impedance | ±10% | ±8% |
| Anawaena puka liʻiliʻi | 0.2mm | 0.15mm | Lakiō hiʻohiʻona (0.2mm）) | 10:1 | 12:1 |
| ʻO ka ʻae ʻana i ke anawaena o ka lua paʻi kūpono | 0.05mm | 0.05mm | Nui huahana pau | 55-600mm | 10-620mm |
| ʻano hoʻolaha | ʻO CNC, V-CUT, Kuʻi ʻana a i ʻole ka ʻōpala |
| Lapaʻau ʻili | EING, OSP, kala kaiapuni, OSP+ENIG koho |
| ʻAno Laminate | FR-4.0, FR-4.1(TG maʻamau, TG waena, TG kiʻekiʻe), CEM-3, |
