Hoʻohālikelike ʻia nā papa kaapuni multilayer ma ke ʻano he 10-20 a i ʻole nā papa kaapuni multilayer kiʻekiʻe, ʻoi aku ka paʻakikī o ka hana ʻana ma mua o nā papa kaapuni multilayer maʻamau a koi aku i ke ʻano kiʻekiʻe a me ka ikaika.Hoʻohana nui ʻia i nā lako kamaʻilio, nā kikowaena kiʻekiʻe, nā uila uila, ka mokulele, ka mana ʻoihana, ka pūʻali koa a me nā ʻano ʻē aʻe.I nā makahiki i hala iho nei, ua ikaika mau ka mākeke no nā papa kaapuni multi-layer ma ke kahua o ke kamaʻilio, nā kahua kahua, nā mokulele, a me nā pūʻali koa.
Hoʻohālikelike ʻia me nā huahana PCB kuʻuna, loaʻa nā ʻano o nā papa kaapuni multi-layer i nā hiʻohiʻona o ka papa mānoanoa, ʻoi aku ka nui o nā papa, nā laina paʻa, ʻoi aku ma o nā lua, ka nui o ka ʻāpana, a me ka ʻāpana dielectric lahilahi.He kiʻekiʻe ka pono o ka moekolohe.Hōʻike pōkole kēia pepa i nā pilikia kaʻina hana nui i loaʻa i ka hana ʻana i nā papa kaapuni kiʻekiʻe, a hoʻolauna i nā kumu nui o ka hoʻomalu ʻana i nā kaʻina hana nui o nā papa kaapuni multilayer.
1. Paʻakikī i ka hoʻoponopono ʻana i waena o ka papa
Ma muli o ka nui o nā papa i kahi papa kaapuni multi-layer, ua kiʻekiʻe a kiʻekiʻe nā koi o nā mea hoʻohana no ka calibration o nā papa PCB.ʻO ka maʻamau, hoʻohana ʻia ka alignment tolerance ma waena o nā papa ma 75 microns.Ke noʻonoʻo nei i ka nui nui o ka papa kaapuni multi-layer, ke kiʻekiʻe o ka wela a me ka haʻahaʻa i ka hale hana hoʻololi kiʻi, ka dislocation stacking ma muli o ka like ʻole o nā papa kumu like ʻole, a me ke ʻano hoʻonohonoho interlayer, ka mana kikowaena o ka multi-layer. ʻoi aku ka paʻakikī o ka papa kaapuni.
Papa kaapuni lehulehu
2. Paʻakikī i ka hana ʻana i nā kaapuni kūloko
Hoʻohana nā papa kaapuni multilayer i nā mea kūikawā e like me ka TG kiʻekiʻe, ka wikiwiki kiʻekiʻe, ke alapine kiʻekiʻe, ke keleawe mānoanoa, a me nā ʻāpana dielectric lahilahi, e hoʻopuka ana i nā koi kiʻekiʻe no ka hana kaapuni kūloko a me ka mana kiʻi nui.No ka laʻana, hoʻohui ka pono o ka hoʻouna ʻana i ka hōʻailona impedance i ka paʻakikī o ka hana kaapuni kūloko.
He liʻiliʻi ka laulā a me ka laina laina, ua hoʻohui ʻia nā ʻāpana ākea a me nā pōkole pōkole, ua hoʻohui ʻia nā kaapuni pōkole, a ua haʻahaʻa ka hele ʻana;nui nā ʻāpana hōʻailona o nā laina lahilahi, a ua hoʻonui ʻia ka nui o ka ʻike leakage AOI i ka papa o loko;ʻO ka papa kumu o loko he lahilahi, maʻalahi ke wrinkle, maikaʻi ʻole ka ʻike ʻana, a maʻalahi hoʻi e wili i ka mīkini etching;ʻO nā papa kiʻekiʻe ka hapa nui o nā papa ʻōnaehana, nui ka nui o ka ʻāpana, a ʻoi aku ke kumukūʻai o ka ʻoki ʻana i nā huahana.
3. Paʻakikī i ka hana ʻana i ka Compression
Nui nā papa i loko a me nā papa prepreg i hoʻopaʻa ʻia, e hōʻike wale ana i nā hemahema o ka paheʻe, delamination, resin voids a me nā koena bubble i ka hana stamping.I ka hoʻolālā ʻana o ka hale laminate, pono e noʻonoʻo pono ʻia ke kūpaʻa wela, ka pale ʻana i ke kaomi, ka maʻamau kelu a me ka mānoanoa dielectric o ka mea, a pono e hoʻolālā ʻia kahi hoʻolālā paʻi ʻana o ka papa kaapuni multilayer kūpono.
Ma muli o ka nui o nā papa, ʻaʻole hiki i ka hoʻonui ʻana a me ka hoʻokaʻawale ʻana a me ka nui o ka coefficient uku ke hoʻomau i ka kūlike, a maʻalahi ka maʻalahi o ka interlayer insulating layer, e alakaʻi ana i ka hemahema o ka hoʻokolohua hilinaʻi interlayer.
4. Paʻakikī i ka hana ʻana
ʻO ka hoʻohana ʻana i ka TG kiʻekiʻe, ka wikiwiki kiʻekiʻe, ke alapine kiʻekiʻe, a me ka mānoanoa o nā pā keleawe keleawe e hoʻonui ai i ka paʻakikī o ka wili ʻana i ka roughness, drill burrs a me ka decontamination.He nui ka helu o nā papa, ua hōʻiliʻili ʻia ka mānoanoa keleawe a me ka mānoanoa o ka pā, a maʻalahi ka haki ʻana o ka mea hana wili;ka pilikia hemahema CAF i hoʻokumu ʻia e ka BGA i puʻunaue nui ʻia a me ke ākea o ka pā puka haiki;ka pilikia o ka wili ʻana ma muli o ka mānoanoa pā maʻalahi.Papa kaapuni PCB
Ka manawa hoʻouna: Iulai-25-2022