Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

ʻO ke kumu kūʻai ʻo Aluminum core laminated copper foil SinkPAD PCB

He aha ka Thermoelectric Separation Substrate?

Hoʻokaʻawale ʻia nā papa kaapuni a me ka pā wela ma luna o ka substrate, a ʻo ke kumu wela o nā mea wela e hoʻopili pololei i ka mea hoʻokele wela e hoʻokō i ka hopena maikaʻi loa (zero thermal resistance).ʻO ka mea maʻamau o ka substrate he mea metala (Copper) substrate.

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Nā kikoʻī PCB

ʻAno PCB	ʻenehana SinkPAD II
Nui PCB	50.0×60.0mm
Kinohi	Na Papa Poai
ʻAno Metala Kumu	Aluminum
Hoʻopau Mānoanoa	0.062 iniha (1.57 mm)
Alanui Thermal Direct	ʻAE
ʻO ka hoʻoili wela	240.0 W/mK
Hoʻopau ʻili	LF HASL
Ke aniani hoʻololi Temp.	170 degere Celsius
UL Aponoia	ʻAe
Hoʻokō RoHS	ʻAe