ʻO ke alapine kiʻekiʻe PCB invert-er FR4 aelike hana OEM maʻamau hoʻolālā kaapuni papa PCB
Nā kikoʻī huahana
Mea Kumu:FR4, FR4/TG FR-4/M4/M6/Rogers/NELCO/ISOLA
Mānoanoa keleawe:0.5-2oz
Mānoanoa Papa: 0.4-4.2mm
Min.Ka nui o ka puka: 0.1-6.5mm
Min.Laina Laina:3mil
Min.Kaawale Laina:3mil
Hoʻopau ʻili: ENIG, HASL, OSP, ENEPIG, Flash Gula
Hua'ōlelo: PCB alapine kiʻekiʻe
Ka Lae Nui: 8L
Hua'ōlelo huahana: I loko o 2 hola
PCB Kūlana:IPC-A-600
Hāʻawi laʻana: I loko o 24 hola
Hana: 24Hora nā lawelawe ʻenehana
Māka Solder: ʻOmaomao Solder Mask/ʻeleʻele PI/Yellow PI
Kaao: Keʻokeʻo, ʻEleʻele, ʻulaʻula, Melemele
Nā kikoʻī huahana
| 'ikamu | MAKEMAKE | FLEX | KAUKA-PELE |
| Papana Max | 60L | 8L | 36L |
| Layer Iloko Min Trace/Space | 3/3mil | 3/3mil | 3/3mil |
| Ma waho o ka Layer Min Trace/Space | 3/3mil | 3.5/4mil | 3.5/4mil |
| Ka Lae Loko Max Copper | 6oz | 2oz | 6oz |
| Ma waho o ka Layer Max Copper | 6oz | 2oz | 3oz |
| Min wili Mechanical | 0.15mm | 0.1mm | 0.15mm |
| Min Laser Drilling | 0.1mm | 0.1mmItemRIGIDFLEXRIGID-FLEX | 0.1mm |
| Laki hiʻohiʻona | 20:1 | 10:1 | 12:1 |
| Laki hiʻohiʻona | 1:1 | / | 1:1 |
| Press Fit Hole Tolerance | ±0.05mm | ±0.05mm | ±0.05mm |
| PTH hoʻomanawanui | ±0.075mm | ±0.075mm | ±0.075mm |
| NPTH hoʻomanawanui | ±0.05mm | ±0.05mm | ±0.05mm |
| Hoʻomanawanui Countersink | ±0.15mm | ±0.15mm | ±0.15mm |
| Mānoanoa Papa | 0.4-8mm | 0.1-0.5mm | 0.4-3mm |
| Ka Mānoanoa Papa (<1.0mm) | ±0.1mm | ±0.05mm | ±0.1mm |
| Ka Mānoanoa Papa (≥1.0mm) | ±10% | / | ±10% |
| Hoʻomanawanui impedance | Hoʻokahi-Hoʻopau:±5Ω(≤50Ω),±7%(>50Ω) | Hoʻokahi-Hoʻopau:±5Ω(≤50Ω),±10%(>50Ω) | Hoʻokahi-Hoʻopau:±5Ω(≤50Ω),±10%(>50Ω) |
| ʻokoʻa:±5Ω(≤50Ω),±7%(>50Ω) | ʻokoʻa:±5Ω(≤50Ω),±10%(>50Ω) | ʻokoʻa:±5Ω(≤50Ω),±10%(>50Ω) | |
| Min Nui Papa | 10*10mm | 5*10mm | 10*10mm |
| Nui Papa Nui | 22.5*30 iniha | 9*14 iniha | 22.5*30 iniha |
| Ka hoʻomanawanui ʻana | ±0.1mm | ±0.05mm | ±0.1mm |
| Min BGA | 7mil | 7mil | 7mil |
| Min SMT | 7*10mil | 7*10mil | 7*10mil |
| Lapaʻau ʻili | ENIG, Manalima Gula, Kālā Kaiapuni, Kino Immersion, HASL(LF), OSP, ENEPIG, Flash Gula; Ka uhi gula paakiki | ENIG, Manalima Gula, Kālā Kaiapuni, Kino Immersion, HASL(LF), OSP, ENEPIG, Flash Gula; Ka uhi gula paakiki | ENIG, Manalima Gula, Kālā Kaiapuni, Kino Immersion, HASL(LF), OSP, ENEPIG, Flash Gula; Ka uhi gula paakiki |
| Palekana Solder | ʻOmaomao, ʻeleʻele, ʻulaʻula, ʻulaʻula, Matt Green | ʻOmaomao Solder Mask/ʻeleʻele PI/Yellow PI | ʻOmaomao, ʻeleʻele, ʻulaʻula, ʻulaʻula, Matt Green |
| Min Solder Mask Clearance | 1.5mil | 3mil | 1.5mil |
| Min Solder Mask Dam | 3mil | 8mil | 3mil |
| Kaao | Keʻokeʻo, ʻeleʻele, ʻulaʻula, melemele | Keʻokeʻo, ʻeleʻele, ʻulaʻula, melemele | Keʻokeʻo, ʻeleʻele, ʻulaʻula, melemele |
| Min Legend Laula/Kiʻekiʻe | 4/23mil | 4/23mil | 4/23mil |
| Ka Laulā ʻAi ʻAi ʻAi | / | 1.5±0.5mm | 1.5±0.5mm |
| Kakaka & wili | 0.30% | / |
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
