ʻO ka pale maka Green Green INK FR4 Gh60 8 Layer 94V0 Gold Plating Rigid PCB Hookah

kū i ka ipad hoʻoneʻe, nā mea paʻa papa paʻa


ʻIke kikoʻī

Hōʻike Huahana

Ka helu o nā papa: 2-60 papa

Nā Pono Hana: Fr4, Fr-4, ALU, Roger, noa kēpau

Papa mānoanoa: 0.2mm-3.5mm

Min. Ka Hole Nui: 0.1mm

Min. Laula ka laula: 3mils

Min. Ke kaʻawale laina: 3mils

Ka pau ʻana o ka ʻili: ke gula immersion, OSP

Ka inoa huahana: FR4 gh60 8 layer 94vo gula plating paʻa PCB mea hana

Launch: PCBA Papa Hana Papa Hana Prototype PCB Assembly

ka hoʻopau ʻana o ka honua: gula / piʻina / Au / kālā / tin, OSP, HASL

Noi: Mea Uila Uila

ʻO ka waihoʻoluʻu paʻa paʻa: ʻO Green White Red Blue ʻEleʻele

ʻAno PCBA: Papa hana uila

Kau: 1-48 Layers (hoʻokomo Rigid-Flex PCB)

PCB Fireproof: 94v0

Palapala: ISO / ISO / ROHS / TS16949

Mānoanoa keleawe: 1-2oz

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Hoʻolālā Hoʻonohonoho CB

E ʻoluʻolu i hāʻawi ʻia: Kiʻikuhi Skimika, waihona waihona (ʻikepili pepa), DXF hale, nā pono hoʻolālā.

PCB hana 

E ʻoluʻolu hāʻawi: Gerber file etc.

Nā ʻāpana sourcing

E ʻoluʻolu i hāʻawi ʻia: ʻo ka papa inoa BOM i hoʻopili ʻia me ka helu ʻāpana.

ʻAha PCB

ʻO nā mea i luna o nā faila PCB a me nā papa inoa BOM.

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FR-4 PCB Hiki i ke ʻenehana

'Ikamu Makahiki maʻamau Palena hiki 'Ikamu Makahiki maʻamau Palena hiki
Layer No. 2-16 ≤20 Max. mānoanoa keleawe (papa o loko) 4OZ 5OZ
Ka mānoanoa o ka papa Core 0.075-2.0mm 0.05-3.0mm Max. mānoanoa keleawe (Outer layer) 4OZ 6OZ
min. PTH i ke keleawe 165.1um 152.4um Min. hakahaka ma waena o nā pads SMD no ke alahaka S / M 203.2um 177.8um
Ka mānoanoa o ka papa (ʻelua ʻaoʻao) 0.3-3.2mm 0.3-4mm Ka laulā liʻiliʻi / kiʻekiʻe 127um / 762um 101.6um /609.6um
Ka mānoanoa o ka papa(Pā-maha) 0.6-3.2mm 0.6-4mm ʻO ke ahonui ʻaukā outline ± 101.6um  ± 76.2um 
ʻO ke ahonui o ka mānoanoa o ka papa (T≤0.8mm) 0.1mm 0.075mm Kulou & wili (T≤1mm) ≤0.75% ≤0.5%
Ke ahonui o ka mānoanoa o ka papa(T > 0.8mm) ± 10% ± 5% Kulou & wili (T≤1mm) ≤0.5% ≤0.3%
Min. laula laina 76.2um 63.5um  Precision of hole to hole ± 0.05mm /
Wahi laina liʻiliʻi 68.58um 63.5um Laulā mana Impedance ± 10% ± 8%
Minimum anawaena lua 0.2mm 0.15mm Lākiō hiʻohiʻona (0.2mm) 10: 1 12: 1
ʻO ke ahonui o ke kaomi pono puka kahe 0.05mm 0.05mm Pau ka nui o ka huahana 55-600mm 10-620mm
hana hoʻopuka ʻO CNC, V-CUT, Punching a punahelu paha
Lapaʻau ʻilikai EING 、 OSP silver Kālā immersion 、 OSP Selective + ENIG
ʻAno lamineka FR-4.0, FR-4.1 (Normal TG, waena TG, kiʻekiʻe TG), CEM-3,

 

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