EMC Design Spark FR4 PCB A me ka Papa Kaapuni Pai

Huahana Huahana

Mea Kumu:FR4

Mānoanoa keleawe:1oz

Mānoanoa Papa:1.6mm

Min.Ka nui o ka puka:0.2mm

Min.Laina Laulā:0.1mm

Min.Kaawale Laina:0.1mm

Hoʻopau ʻili: HASL

Palekana Solder: ʻOmaomao

Pale Silk: Keʻokeʻo

Ho'āʻo PCB: Hoʻāʻo-rig, Hoʻāʻo ʻImi Lele

Ho'āʻo PCBA: X-ray, AOI Test, Functional ho'āʻo

Palapala:UL.ROHS.CE

Ke ʻano o nā lawelawe: High Quality PCB Manufacturing

Hua'ōlelo: blank PCB papa kumu kūʻai

Ka lawelawe: One-stop Service

Papahana: 1-24 mau papa

'ikamu	Hōʻike
1	Ka helu o ka Layer	1-18Papa
2	Mea waiwai	FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3,ceramic, kīʻaha Lamina
3	Hoʻopau ʻili	HASL(LF), ka uhi gula, Electrolysis nickel immersion gula, Immersion Tin, OSP
4	Hoʻopau Mānoanoa Papa	0.2mm-6.00 mm(8mil-126mil)
5	Mānoanoa keleawe	1/2 oz min;12 oz max
6	Palekana Solder	ʻOmaomao/ʻeleʻele/keʻokeʻo/ʻulaʻula/uliuli/melemele
7	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
8	Min.Hole Diameter no ka CNC Drilling	0.1mm(4mil)
9	Min.Hole Diameter no ke kuʻi ʻana	0.9mm(35mil)
10	ʻO ka nui o ka panel	610mm*508mm
11	Kūlana Puka	+/-0.075mm(3mil) ʻO ka ʻeli ʻana o CNC
12	Laulā o ke alakai (W)	0.05mm(2mil) a i ʻole;+/-20% o ka hana noʻeau kumu
13	Anawaena puka (H)	PTH L:+/-0.075mm(3mil);NON-PTH L:+/-0.05mm(2mil)
14	Hoʻomanawanui Outline	0.125mm(5mil) CNC Alanui;+/- 0.15mm(6mil) na Punching
15	Warp & Twist	0.70%
16	Kū'ē Kū'ē	10Kohm-20Mohm
17	Conductivity	<50ohm
18	Voltage ho'āʻo	10-300V
19	Nui o ka Panel	110×100mm(min);660×600mm(max)
20	Layer-layer ministry	4 papa: 0.15mm(6mil) max;6 papa:0.25mm(10mil) ka nui
21	Ka lōʻihi liʻiliʻi ma waena o ka ʻaoʻao puka a i ke ʻano kaapuni o kahi papa i loko	0.25mm(10mil)
22	Min. kaawale ma waena o ka papa outline circuitry pattern o kahi papa loko	0.25mm(10mil)
23	Ka mānoanoa o ka papa	4 papa: +/-0.13mm(5mil);6 papa: +/-0.15mm(6mil)
24	Ka hoʻomalu impedance	+/-10%
25	Impedance ʻokoʻa	+-/10%